Thermomechanical Analysis of Electronic Package Using Finite Element Method

This paper deals with the simulation of power electronic components. More precisely it is focused on the modeling approach to emphasize the electro-thermomechanical behavior of materials in power electronics assembly (electronic package). Thermal strains and Stresses constitute an important part of the design considerations for many practical engineering problems. They become especially critical when materials with different coefficients of thermal expansion form interfaces. In this work, an electronic device containing a silicon die (chip), epoxy die attach substrate, and a molding compound is considered for the analysis. A common cause of failure in Electronic devices is the thermal stresses at elevated temperatures caused by a coefficient of thermal expansion mismatch. The present work is focused on the evaluation of the stresses at the interface region at various levels of temperature. The results show that the shear stress magnitude is considerably high compared to other stresses compared to other stresses.